To catalogue
Dicstyrene™ XC-540
- Chemical Family
- Styrenics
Product families
Applications
Electrical & Electronics — Devices & Assemblies
- Displays
- Other Devices & Assemblies
Product Families
Plastics — Basic Thermoplastics
- Styrenics
Other characteristics
- Brand
- Dicstyrene
- Polymer Name
- Polystyrene (unspecified)
- Melt Flow Index
- 2.0 - 2.0 g/10 min
- Processing Methods
- Injection Molding
- Markets
- Electrical & Electronics
- Flame Rating
- IEC 60695-11-10 HB
- Technology
- Plastics
- Material Features
- General Purpose
- Country Availability
- Canada
- China (Mainland)
- USA
- Plastics and Elastomers End Uses
- Electrical/Electronic Applications
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Injection Molding
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Melt Flow Index - MFI (-°C/- kg) | 2 | g/10 min | ISO 1133 |
| Molding shrinkage - parallel | 0.6 | % | ISO 294-4, 2577 |
| Density | 1040 | kg/m3 | ISO 1183 |
Table 2 of 3
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Stress at break | 47 | MPa | ISO 527 |
| Strain at break | 2 | % | ISO 527 |
| Flexural modulus, 23° | 3300 | MPa | ISO 178 |
| Charpy impact strength (+23°) | 2.7 | kJ/m2 | ISO 179/1eU |
| Rockwell Hardness | 68 | Scale M | ISO 2039-2 |
Table 3 of 3
1 row| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Burning Behavior at thickness | HB | class | IEC 60695-11-10 |
