Jowapur® 685.92
- Chemical Family
- Polyurethanes (PU)
Jowapur® 685.92 is a adhesive for bonding mineral aggregate panels, fiberboard, sandwich and composite panels made of soft wood species, for pur foam materials and polystyrene foam, and many other substrates.
Product families
- Other Adhesives & Sealants
Other characteristics
- Brand
- Jowapur
- Cure Method
- Moisture Cure
- Product Type
1K (1 component) Adhesive, Solvent free (100% Solids) Adhesive; 1K (1 component) Adhesive; Solvent free (100% Solids) Adhesive
- Application Method
- Roller
- Compatible Substrates & Surfaces
- Wood
- Base
- 1-Component PUR Prepolymer
- Markets
- Adhesives & Sealants
- Cleaning
Before curing the prepolymer can be cleaned with a solvent-soaked rag for instance using Jowat Thinner 401.30 or with Jowat® PUR Cleaner 402.38. After Curing, only mechanical removal (emery paper).
- Appearance
- brown translucent
- Cure
- Moisture Cure
- Applications
Adhesives & Sealants — Other Adhesives & Sealants Applications
- Technology
- Ready-to-Use Products
- Characteristic
Free of solvents and formaldehyde. Good adhesion to many substrates.
- Labeling Claims
- Formaldehyde-free
- Application Methods
- Roller
- Storage and Transport
The product should remain stored in properly closed original containers, dry and cool (15- 25 °C). Do not transport at temperatures below +5 °C. For best-before date, please see container label. After the elapse of the best-before date, it is essential that you again verify that the product is fit for your intended application.
- General Bonding Requirements
The properties (e.g. Surface tension, plasticiser content...) and the conditioning of the substrates, as well as the processing conditions (e.G. Ambient temperature, humidity...) will influence the processes of joining and bonding. Customer tests under consideration of everyday production conditions are therefore absolutely necessary to define stable process parameters and to ensure that the product is fit for purpose. For best bonding results, the materials to be bonded should be free of dust, oil, and grease, and be dry. Ideally, the minimum temperature should be at 18 °c. Avoid draft.
- Ready to Use Product Features
- Excellent Substrate Adhesion
- Excellent Water Resistance
- Heat Resistance
- High Strength
- Compatible Substrates and Surfaces
- Wood
Technical data
Table 1 of 1
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Viscosity / Temperature | 6000 / 20 | mPas/°C | — |
| Processing Temperature | min. 10 | °C | — |
| Processing temperature | min. +10 | °C | — |
| Foaming | low | — | — |
| Open time ( +20°C/ 50 % RH) | 85-95 | minutes | Jowat test method |
| Pressing time(+20°C) | 260-280 | — | Jowat test method |
| Density (at +20 °C) | approx. 1.10 ± 0.05 | g/cm* | Jowat test method |
| Solids content | approx. 95 ±5 | % | Jowat test method |
| pH value | approx. 14 ± 1 | — | — |
| Viscosity (+20 C, Brookfield, RV, spindle 5, 20 rpm) | 7,000 500 | mPas | — |
