SHD Composites MTFA500
- Chemical Family
- Epoxy & Epoxy Derivatives
Shanghai Sunwise Chemical MTFA500 (DF044) toughened epoxy adhesive film is design to cure between 80°C and 120°C, allowing flexibility in component manufacture.
Product families
- Adhesives
Other characteristics
- Functions
- Adhesive, Surface Finish
- Markets
- Consumer Goods
- Applications
- Consumer Goods — Sports & Recreation
- Key Features
Cure temperature from 80°C to 120°C; Service temperature up to 135°C after post cure; Low CTE and shrinkage; Work life at 20°C: 30 days; Storage life at -18°C: 12 months; Very low VOC content – no added solvents during manufacture
- Technology
- Composite Materials
- Packaging Type
- Bags
- Labeling Claims
- Low VOC
- Health and Safety
This material contains epoxy resin which can cause allergic reactions with skin contact and must avoid repeated and prolonged skin contact.; The following precautions must be taken when using epoxy resin prepregs:; Overalls must be worn; Impervious gloves must be worn.; Curing schedule is meant to be as a guide only and is subject to local conditions.; To avoid exotherm, particular care must be taken with thick laminates.; Ramp rates must not exceed 3.0°C/min during initial cure and 0.3°C/min during post cure.
- Material Features
- Excellent Toughness
- Improved Flexibility
- Low Shrinkage
- Storage and Out Life
This material should be kept frozen at -18°C. It must be kept sealed in a polythene bag which must not be opened until fully thawed to room temperature. If the material is not fully used, then the material must be resealed in the polythene bag to prevent moisture absorption.
- Typical Applications
- General purpose
- Recommended Cure Cycle
Recommended Initial cure: 80°C for 16h, at a ramp rate of 2°C/min; Recommended Post cure: 120°C for 1h, at a ramp rate of 0.3°C/min (where required for high Tg); Curing Schedule is meant to be a guide only and is subject to local conditions.; To avoid exotherm particular care must be taken with thick laminates.; Ramp rates must not exceed 3.0°C per minute during initial cure.; Ramp rates must not exceed 0.3°C per minute during post cure.
- Composite Materials Functions
- Adhesive
- Surface Finish
- Composites Processing Methods
- Prepreg Processing
Technical data
Table 1 of 1
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Cure Temperature | 80 -120 | °C | — |
| Cure Time | 16 - 1 | — | hrs,mins |
| Outlife | 30 | — | months |
| Tg Onset | 141 | — | — |
| Tg Peak | 150 | — | — |
| Service Temperature | 135 | °C | — |
