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KERFAID™ DICING SURFACTANT KA-286

KERFAID™ DICING SURFACTANT KA-286 is a highly concentrated formula, providing a lower cost of ownership. Includes the cleaning power of the other formulation, along with a corrosion inhibitor.

Properties

Physical Form
Liquid

Product families

Applications

HI&I Care — Home Care
  • Surface Care

Product Families

Ready-to-Use Products — Cleaners
  • Commercial Cleaners

Other characteristics

Brand
KERFAID
Features

Corrosion Resistant, Cost Effective, Water Soluble; KerfAid Dicing Surfactant has four main functions: surfactant, lubricant, corrosion inhibitor and ESD preventative. All these factors contribute to an enhanced saw dicing process with improved yields.; Improved saw cut; Reduced bond pad corrosion; Reduced corrosion

Product Type
Cleaner
Application Area
  • Equipment, Wafer Thinning
  • Equipment
  • Wafer Thinning
Markets
HI&I Care
Storage
Cool dark location.
Material

Materials suited for processing with KERFAID™ DICING SURFACTANT KA-286 dicing fluid includes: silicon, germanium, glass, ceramics and diamond. KERFAID™ DICING SURFACTANT KA-286 can also be used to process compound semiconductor materials including: silicon carbide, gallium arsenide, indium phosphide, gallium nitride, aluminum antimonide, etc.

Technology
Ready-to-Use Products
Packaging Type
  • Bottles
  • Drums
  • Jars
  • Totes (IBC)
Container Sizes

The one-gallon bottle is the lightest and easiest to use at the point of consumption. It is often used when the process is in the development stage.; The five-gallon jug is designed to fit inside all Dynatex DXL Surfactant Dispensers.; The fifty-five-gallon drum is economical and convenient for higher volume production.; The one-metric ton tote is preferred for international ocean shipments.

Labeling Claims
  • Animal Products-free
  • Biodegradable
  • Environmentally Friendly
HIGHLIGHTS

KERFAID™ DICING SURFACTANT KA-286 is a concentrated, aqueous-based solution of wetting agents and surfactants that reduces heat build-up and move swarf particles away from the kerf during the saw dicing process. It is completely water soluble, biodegradable and non-corrosive.. Given a potential for a 30% increase in blade life, improved cleanliness and up to 60% reduction of chipping an cracking, KerfAid Dicing Surfactant is a cost cutting, yield improving solution. When added to the cutting water by the DXL Series Surfactant Dispenser, KerfAid Dicing Surfactant provides an effective, integrated solution for improving saw dicing operations.

Resistivity Control

Wafer dicing has been recognized as a major factor in promoting clean wafers and an ESD safe environment. KA-286 replaces the older, more expensive process of bubbling CO2 through the dicing water. De-ionized water has a resistance that is typically 18 MΩ. Dicing water should be below 1 MΩ. KA-286 is used to adjust the resistivity of the water to below 0.1 MΩ, as shown in the table to the left.. Resistivity (MΩ-cm)

Ready to Use Product Features
  • Corrosion Resistant
  • Cost Effective
  • Water Soluble
Provides a Solution To
  • Bond Pad Staining
  • Process Expense
  • Chipping/Cracking
  • Particulates/Contamination
  • Process Time
  • Galvanic Corrosion

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