To catalogue

Polynt Group HUP 19/28 RB GO-9500

Polynt Group HUP 19/28 RB GO-9500 is generally used in electronic and electrical applications.

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Electrical & Electronics — Parts & Components
  • Housings & Enclosures
  • Printed Circuit Boards (PCBs)
Automotive & Transportation — Transportation
  • Rail & Mass Transit

Product Families

Composite Materials — Prepregs & Molding Compounds
  • Sheet Molding Compounds (SMC)

Other characteristics

Functions
Molding Compound
Markets
  • Automotive & Transportation
  • Consumer Goods
  • Electrical & Electronics
Technology
Composite Materials
Handling
  • Storage condition store dry at max
  • 25 °C and out of direct sun light
  • Molding time > 25 sec
  • /mm
  • Molding pressure 80 - 100 bar
  • Molding temperature 140 - 150 °C
Composite Materials Functions
Molding Compound

Technical data

Table 1 of 1

16 rows
CharacteristicValueUnitMethod
Surface Resistancemax. 10^9OhmIEC 93
fibre length25mmPA 3.01
heat distortion temperaturemin. 200°CISO 75-2°
surface weight4g/m2ISO 10352
fibre Content28%ISO 1172
Flexural modulus10N/mm2ISO 14125
Curing Time60secISO 12114/1
Water absorption50mgISO 62
Flexural strength150N/mm2ISO 14125
impact strength60KJ/m2ISO 179
Specific Density178g/cm3ISO 1183 A
Shrinkage14%ISO 2577

The Omnichem website uses cookies. By continuing to use the site, you consent to their use in accordance with our Privacy Policy and to the collection of analytics.