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Polynt Group HUP 17/29 RB-7032

Polynt Group HUP 17/29 RB-7032 is generally used in electronic and electrical applications.

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Electrical & Electronics — Parts & Components
  • Housings & Enclosures
  • Printed Circuit Boards (PCBs)
Automotive & Transportation — Transportation
  • Rail & Mass Transit

Product Families

Composite Materials — Prepregs & Molding Compounds
  • Sheet Molding Compounds (SMC)

Other characteristics

Functions
Molding Compound
Markets
  • Automotive & Transportation
  • Consumer Goods
  • Electrical & Electronics
Technology
Composite Materials
Composite Materials Functions
Molding Compound

Technical data

Table 1 of 1

16 rows
CharacteristicValueUnitMethod
Shrinkage0,10%CHECK 02/09
Density (spec. Density)1,70g/cm3CHECK 09.01
thermal deformation temperature (heat distortion temperature)min. 200°CISO 75-2°
tracking resistanceCTI 600poziom(level)IEC 112
unit of surface weight4.085g/m2CHECK 03.03
fiber length25/50mmCHECK 03.01
Flexural modulus9.3N/mm2CHECK 08.02
Flexural strength190N/mm2CHECK 08.01
impact strength80KJ/m2CHECK 08.03
incandescence bar testmax. 10mmIEC 707
dielectric strength15KV/mmIEC 243-1
volume resistance10^14Ohm x cmIEC 93

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