TEPIC® S
- CASE Ingredients Features
- Heat ResistanceSolvent Resistance
- Chemical Family
- Polyisocyanates
TEPIC® S Tris (2,3-Epoxy propyl) Isocyanurate, is a unique symmetrical triazine contains tri-functional epoxy compound which entirely different from conventional bisphenol type epoxy resin. TEPIC is well suited for electronic coatings and plays a crucial role as the the cross-linker integrity of solder mask, in transparency of LEDs, and in outdoor durability of powder coating.
Properties
- Physical Form
- Powder
- Solid
Identification
- CASE Ingredients Functions
- Crosslinking Agent
Product families
Applications
- Paints & Coatings — Other Paints & Coatings Applications
- Electronics Coatings
- Printed Circuit Boards (PCBs)
- Electronics Coatings
Product Families
- Chain Extenders & Crosslinkers
Other characteristics
- Brand
- TEPIC
- End Uses
- Powder Coating
- Functions
- Crosslinking Agent
- Compatible Polymers & Resins
- Polyesters
- Markets
- Electrical & Electronics
- Paints & Coatings
- Appearance
- Powder
- Properties
High cross-linking density with excellent heat resistance and thermosetting performance.; Minimum UV and lighting absorption provide with superb visibility.; Disperse fine powder with suspension stability for reactive latency.; Low chlorine contents, inhibit deterioration and electrolytic corrosion.
- Application
TEPIC consists of triazine nucleus and three glycidyl group. TEPIC triazine nucleus imparts outdoor durability due to low UV absorption. TEPIC three glycigyl group imparts high heat resistance due to high cross link density. TEPIC has a wide variety of industrial applications such as:; Print circuit board (PCB) – Top-coated ink – Solder-resistant ink (PCB solder mask) – High performance SRI for PC and Cell Phone – Short circuit prevention: Permanent protective coating of PCB – Increased heat and solvent resistance– Resolving power up; Transparent encapsulate (LED, CCD); Semiconductor encapsulate; Plastic, rubber, and adhesive additive; Outdoor polyester powder coating
- Coating Type
- Powder Coating
- Technology
- CASE Ingredients
- Compatible Polymers and Resins
- Polyesters
- Compatible Substrates and Surfaces
- Elastomers & Rubbers
- Plastics
Technical data
Table 1 of 1
15 rows| Characteristic | Value | Unit |
|---|---|---|
| Epoxy Equivalent Weight | max. 105 | g/equiv. |
| Hydrolyzable Chlorine | max. 0.15 | % |
| Melting Point | 95 - 125 | °C |
| Particle Size (mesh pass min. 99%) | 42 | nm |
| Solubility in DMF at 20°C | 6.4 | g/100g |
| Solubility in Ethyl acetate at 25°C | 1.5 | g/100g |
| Solubility in Ethyl acetate at 40°C | 4.6 | g/100g |
| Solubility in MEK at 20°C | 1.1 | g/100g |
| Solubility in MEK at 25°C | 2 | g/100g |
| Solubility in MEK at 40°C | 6.8 | g/100g |
| Solubility in PGME at 25°C | 1.6 | g/100g |
| Solubility in PGME at 40°C | 2.9 | g/100g |
