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Fluon+™ LM-ETFE LH-8000

Chemical Family
Fluoropolymers

AGC Chemicals Americas, Inc. Fluon+™ LM-ETFE LH-8000 is a new addition to the LM-ETFE AH Series. This ETFE (tetrafluoroethylene-ethylene copolymer) has a functional group polymerized directly in to the chain backbone, allowing it to adhere to other materials. This resin is ideal for producing multi-layer structures in a one-step process without the need for surface treatment or a separate adhesive layer. LH-8000 offers the lowest melting point of all the AH series resins, yet with the same desirable properties of other ETFEs, including non-stick, excellent processability, and superior chemical resistance.

Identification

CASE Ingredients Functions
Binder & Resin

Other characteristics

Brand
Fluon+
Polymer Name
Ethylene Tetrafluoroethylene Copolymer (ETFE)
Processing Methods
Coextrusion
Compatible Substrates & Surfaces
Metal
Markets
  • Automotive & Transportation
  • Electrical & Electronics
  • Industrial
  • Printing & Packaging
Technology
  • CASE Ingredients
  • Plastics
Labeling Claims
Non-Flammable
Statement of Use

The Fluon® and Fluon+™ products are manufactured and sold for industrial applications. The purchasers are responsible for confirming whether the product quality is appropriate for their applications.The product is not designed for special application such as pharmaceutical or medical use. Not all grades are appropriate for end products or materials for substances that come in contact with food. For the latest information, contact our representatives. Carefully examine how to handle the products stated in this material with reference to our Safety Data Sheet (SDS).

Material Features
  • Chemical Resistant
  • Excellent Transparency Properties
  • Good Adhesion
  • Good Electrical Properties
  • Good Mechanical Properties
  • Good Processability
  • Low Melting Point
  • Low Mold Shrinkage
Features

The lowest melting point in the LM-ETFE Adhesive materials (180ºC vs. 240ºC); Wide range of processing temperatures between the melting point of 180ºC and the onset of degradation at 395 ºC; Excellent adhesion to other materials, such as polyamides, polyethylenes, or metals; Corrosive off-gas levels at melt processing are very low; Equivalent mechanical, chemical resistance, electrical, and non-stick properties to conventional ETFE resins; High transparency, low mold shrinkage

Technical information

The information and data stated in this material (and any information and data provided to customers) are based on actual data obtained from reliable sources and should not be considered as guaranteed values for matters not stated in this material. We hereby disclaim any warranties, whether express or implied, regarding this material. The user is responsible for complying with all relevant laws and regulations irrespective of whether stated in this material or not. The provision of this material does not grant a license to any patents, trademarks, or licenses for those products, or any licenses to other intellectual properties.

Certifications and Compliance
FDA Compliant
Compatible Polymers and Resins
  • Polyamides
  • Polyethylenes (PE)
Plastics and Elastomers End Uses
  • Air Hose
  • Automotive Fuel Structural Components
  • Containers
  • Conveyor Parts
  • Electronic Insulation
  • Film
  • Hoses
  • Industrial Containers

Technical data

Table 1 of 1

13 rows
CharacteristicValueUnitMethod
Dielectric Constant (at 1 MHz)2.5—ASTM D150
Dissipation Factor (at 1MHz)0.0093—ASTM D150
Flexural Modulus970MPaASTM D790
Hardness65—Shore D
Izod Impact Strength (at 23°C,Notched)Non BreakJ/mASTM D256
Melting Point180ºCDSC
MFR4g/10 minASTM D1238 (230ºC,21.2N)
MIT Folding Endurance1.0 x 10⁵CyclesASTM D2176
Specific Gravity1.75—ASTM D792
Specific Heat1.2kJ/(kg•K)—
Tensile Elongation (at Break)460%ASTM D638
Tensile Strength (at Break)48MPaASTM D638

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