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KİSAMİD® 1023
- CASE Ingredients Features
- Low Temperature-Curing
- Chemical Family
- Polyamines
KİSAMİD® 1023 is a formulated polyamine adduct used in SF epoxy systems and can be cured at low temperatures. KISAMID® 1023 can be used in combination with other hardeners in SF coatings, adhesives, mortars, self leveling.
Identification
- CASE Ingredients Functions
- Curing Agent
Product families
CASE Ingredients — Additives
- Functional Additives
Other characteristics
- Brand
- KISAMID
- End Uses
- Solventless & High Solids Coating
- Features
- Low Temperature-Curing
- Functions
- Curing Agent
- Compatible Polymers & Resins
- Epoxies (EP)
- Markets
- Adhesives & Sealants
- Paints & Coatings
- Applications
Adhesives & Sealants — Other Adhesives & Sealants Applications; Paints & Coatings — Other Paints & Coatings Applications
- Coating Type
- Solventless & High Solids Coating
- Technology
- CASE Ingredients
- Compatible Polymers and Resins
- Epoxies (EP)
Technical data
Table 1 of 1
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Amine Value | 370-390 | — |
| Color | max. 10 | Gardner |
| Viscosity at 25°C | 850-1000 | mPa.s |
| Solid Content | 100 | % |
| Density at 20°C | 0.95+0.05 | g/ml |
| Active H Equivalent Weight | 95 | — |
| Flash Point | 130 | °C |
| Mixing Ratio | 50 | — |
| Gel Time (100ml/23°C) | 25 | dk |
| Chemical Resistance Acids | 2 | — |
| Chemical Resistance Bases | 0 | — |
| Chemical Resistance Solvents | 2 | — |
