Aptek® 2313-Pmf
Aptek® 2313-Pmf is a one component, premixed-frozen, silver-filled, electrically conductive polymer paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. Aptek® 2313-Pmf is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured. Aptek® 2313-Pmf has excellent reversion resistance and physical stability when subjected to high heat and humidity environments. This system displays higher ionic purity than epoxy systems minimizing the possibility of corrosion on components and circuitry. Aptek® 2313-Pmf Premixed-frozen, snap-cure, electrically conductive, adhesive
Properties
- Physical Form
- Paste
Product families
Applications
- Consumer Goods — Appliances & Electronics; Adhesives & Sealants — Other Adhesives & Sealants Applications; Electrical & Electronics — Other Electrical & Electronics Applications
- Adhesives & Sealants
- Printed Circuit Boards (PCBs)
Product Families
- Conductive Adhesives
- Structural Adhesives
Other characteristics
- Brand
- Aptek
- Product Type
1K (1 component) Adhesive, Conductive Adhesive, Solvent free (100% Solids) Adhesive; 1K (1 component) Adhesive; Conductive Adhesive; Solvent free (100% Solids) Adhesive
- Markets
- Adhesives & Sealants
- Consumer Goods
- Electrical & Electronics
- Technology
- Ready-to-Use Products
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Electrical Corrosion Resistant
- Good Adhesion
- Low Temperature Performance
- Thixotropic
