To catalogue
NanoTach® (nanosilver paste): X Series
- CAS Number
- 7440-22-4
- EC Number
- 231-131-3
- Chemical Name
- Silver
- Chemical Family
- Silver & Silver Compounds
NanoTach® (nanosilver paste): X Series is a thick paste of nano-sized silver powder in an organic binder formulation.
Properties
- Physical Form
- Powder
- Solid
Product families
Applications
Automotive & Transportation — Automotive
- Electrical & Electronic Systems
Electrical & Electronics — Devices & Assemblies
- Automotive Electronics
Industrial — Leather & Textiles
- Textile Manufacturing
Electrical & Electronics — Parts & Components
- Photovoltaic Components
- Semiconductor Manufacturing
- Sensors & Actuators
Printing & Packaging — Printing & Inks
- Screen Printing
Product Families
Base Chemicals & Intermediates — Technical Salts & Inorganics
- Inorganics
Other characteristics
- Brand
- NanoTach
- Synonyms
- Ag
- Labeling Claims
- Organic
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Industrial
- Printing & Packaging
- Storage
Shelf Life - approx. 12 months (If Stored In Sealed Containers At Room Temperature, Before Sintering)
- Key Features
Uniform dispersion for screen/stencil printing or dispensing; Low sintering temperature (<260oC); Excellent sintered properties; RoHS compliant
- Technology
- Base Chemicals & Intermediates
- Packaging Type
- Jars
- Applicable Processes
- Semiconductor Manufacturing
- Sintering
- Base Chemicals End Uses
- Electrical/Electronic Applications
- Base Chemicals Functions
- Binder
- Certifications and Compliance
- RoHS Compliant
- Industrial Additives Functions
- Adhesion Promoter
Technical data
Table 1 of 1
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Solid Loading (Before Sintering) | 71 - 91 | % | — |
| Density (Before Sintering) | min. 3.0 | g/cm3 | — |
| Viscosity (Before Sintering) | 150,000 - 600,000 | cps | — |
| Sintering Temperature (Before Sintering) | max. 260 | °C | — |
| Porosity (After Sintering) | max. 30 | % | — |
| Density (After Sintering) | min. 7.9 | g/cm3 | — |
| Coefficient Of Thermal Expansion (After Sintering) | 19.6 x10⁻⁶ | cm.°C | — |
| Melting Temperature (After Sintering) | 961.0 | °C | — |
| Elastic Modulus (After Sintering) | 10 - 30 | GPa | — |
| Electrical Resistivity (After Sintering) | max. 2.6x10⁻⁶ | ohm-cm | — |
| Thermal Conductivity (After Sintering) | min. 2.0 | watt/cm.°C | Electrical Measurement |
| Chip Bonding Strength (After Sintering) | min. 25 | MPa | — |
