70 Washington Road, Princeton Junction, NJ 08550AI Technology ME 8155
ME8155 is a silver filled paste, reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This paste can be used for screen printing and it can be readily reworked at 80-100°C.
Cure Method:
- Heat Cure
Product Type:
- Epoxy Adhesive
Application Method:
- Injection
Compatible Substrates & Surfaces:
- Aluminum, Copper, Metal
Markets:
- Consumer Goods
- Electrical & Electronics
- Industrial
- Printing & Packaging
Shelf LIfe:
- 1 Year (at -40°C), 3 Months (at 0°C)
Cure:
- Heat Cure
Technology:
- Ready-to-Use Products
Physical Form:
- Paste
Labeling Claims:
- Solvent-free
Product Features:
- Stress free.
- 100% solid.
- Reworkable.
- Electrically conductive.
- Epoxy paste adhesive.
- Large area die.
- Automated assembly.
- Reworkabililty.
- Mismatched CTE's.
Application Methods:
- Injection
Storage Information:
- Storage temperature: -40°C, 0°C.
Availability:
- ME8155 is available in syringes for automatic needle dispense applications or in jars.
Application Procedure:
- Thaw for 30 minutes before opening jar.
- Dispense adhesive onto clean substrate.
- Cure according to one of the recommended schedules.
Certifications and Compliance:
- ISO 9001
Ready to Use Product Features:
- Electrically Conductive
- Good Bonding Strength
- Highly Flexible
- Solventless
- Stress-free
- Thermally Conductive
Compatible Substrates and Surfaces:
- Aluminum
- Copper
- Metal
Applications
Applications
- Consumer Goods — Appliances & Electronics
Industrial — Leather & Textiles
- Textile Manufacturing
Electrical & Electronics — Packaging & Assembly
- Adhesives & Sealants
Printing & Packaging — Printing & Inks
- Screen Printing
Product Families
Ready-to-Use Products — Adhesives & Sealants
- Conductive Adhesives
| Characteristic name | Value | Unit of measurement | Test method |
| Electrical Resistivity (at 150°C, 60minutes) | max. 4x10⁻⁴ | Ω-cm | - |
| Glass Transition Temperature | -22 to -18 | °C | - |
| Glass Transition Temperature | -20 | °C | - |
| Glass Transition Temperature | -25 | °C | - |
| Current Carrying Capabilities | 35 | Amp/mm² | - |
| Lap Shear Strength | min. 6.9 | N/mm² | - |
| Device Push Off Strength | min. 13.8 | N/mm² | - |
| Hardness | 72 - 88 | Shore A | - |
| Cured Density | 3.15 - 3.85 | g/cc | - |
| Thermal Conductivity | min. 6.0 | W/m-°C | - |
| Thermal Conductivity | min. 7.9 | W/m-°C | - |
| Thermal Conductivity | 7.11 - 8.69 | W/m-°C | - |
| Coefficeint of Linear Thermal Expansion | 102 - 138 | ppm/°C | - |
| Maximum Continuous Operation Temperature | max. 150 | °C | - |
| Average Viscosity (at 25°C, 0.5rpm, Spindle CP51) | 283200 - 424800 | cPs | Brookfield Viscometer DV-1 |
| Electrical Resistivity | max. 4x10⁻⁴ | Ω-cm | - |
| Die Shear Strength | min. 1800 | psi | - |
| Die Shear Strength | min. 2000 | psi | - |
| Viscosity (at 0.5 rpm) | 337000 | cPs | - |
| Viscosity (at 0.5 rpm) | 354000 | cPs | - |
